Our in house production capabilities

• High reliability soldering & standards compliance, we don’t just “solder boards” we build to the world’s most unforgiving standards. Whether it’s high-reliability industrial hardware (IPC class 3) or flight-critical satellite modules (ECSS), our certified in-house inspectors scrutinize every joint and thermal path. Because we do the work ourselves in our UK lab, we maintain total accountability for zero-failure performance.
• Space assembly & environmental validation, moving from a laboratory prototype to a flight-ready unit requires a controlled environment. We perform all space-grade assembly within our ISO-Class 7 and 8 cleanrooms to eliminate microscopic contamination. Post-assembly, we put the hardware through its paces in our own thermal chambers, cycling from -70°C to +150°C to simulate the brutal reality of orbital life.
• Complex module integration & physical housing EECL specializes in taking discrete components and integrating them into a fully functional, shielded subsystem. We manage the mechanical fit, thermal management, and electrical interconnects in a single in-house workflow. Having our design and manufacturing teams in the same building means we catch integration challenges on the bench, not after the product has shipped.
• Advanced mm-wave PCB production standard PCB shops often fail at high frequencies. We provide specialized assembly for RF boards, utilizing vapour phase reflow to ensure perfectly uniform heating. This process is critical for complex, high-mass boards where traditional ovens risk cold spots or overheated components, ensuring the dielectric properties of your board remain intact.
• Micro-interconnect & die attach services, for RF modules where standard SMT interconnects introduce too much parasitic loss, we provide precision in-house wedge wire bonding. This allows us to connect bare die and micro-components directly, preserving signal integrity for applications reaching up to 90GHz and beyond.
• Mass scale shielding and thermal interface solutions, we have proven our ability to scale high-precision shielding, having delivered 10,000+ gasket and absorber enclosures to a leader in the quantum computing sector. Using our automated dispensing systems, we apply conductive gaskets, radar absorbent material (RAM), and thermal interface materials (TIM) with microscopic repeatability, ensuring consistent isolation up to 100GHz.